Invention Grant
- Patent Title: Light emitting element and manufacturing method thereof
- Patent Title (中): 发光元件及其制造方法
-
Application No.: US11572547Application Date: 2005-07-27
-
Publication No.: US07683379B2Publication Date: 2010-03-23
- Inventor: Kenji Goto , Takuya Kawashima , Nobuo Tanabe , Tatsuya Ito
- Applicant: Kenji Goto , Takuya Kawashima , Nobuo Tanabe , Tatsuya Ito
- Applicant Address: JP Tokyo
- Assignee: Fujikura Ltd.
- Current Assignee: Fujikura Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2004-223980 20040730; JP2004-223981 20040730; JP2004-223982 20040730; JP2005-201581 20050711
- International Application: PCT/JP2005/013698 WO 20050727
- International Announcement: WO2006/011497 WO 20060202
- Main IPC: H01L27/15
- IPC: H01L27/15

Abstract:
A light emitting device having little variation in the intensity of light emitted from the light emitting surface is provided. The light emitting device of exemplary embodiments of the present invention includes a laminated body with a first conductivity type layer and a second conductivity type layer, with a light emitting portion therebetween. The light emitting device also includes a metal thin film layer on the second conductivity type layer of the laminated body, and a transparent conductor on the metal thin film layer. The transparent conductor includes a single layer of transparent conductive film. The grain size in the light emitting surface of the transparent conductive film is not less than 30 nm and not greater than 300 nm.
Public/Granted literature
- US20070284590A1 Light Emitting Element And Manufacturing Method Thereof Public/Granted day:2007-12-13
Information query
IPC分类: