Invention Grant
US07683393B2 Wiring substrate for mounting light emitting element 有权
用于安装发光元件的接线基板

Wiring substrate for mounting light emitting element
Abstract:
A wiring substrate for mounting a light emitting element, comprising: a substrate body comprising an insulating material and having a first surface and a back surface; and a cavity being opened into the first surface of said substrate body and having a mounting area for mounting a light emitting element at a bottom face of said cavity, wherein a metalized layer provided along a side face of said cavity and metalized layers provided in said substrate body are provided to continue to each other.
Public/Granted literature
Information query
Patent Agency Ranking
0/0