Invention Grant
- Patent Title: Wiring substrate for mounting light emitting element
- Patent Title (中): 用于安装发光元件的接线基板
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Application No.: US11294539Application Date: 2005-12-06
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Publication No.: US07683393B2Publication Date: 2010-03-23
- Inventor: Makoto Nagai , Setsuo Yada , Atsushi Uchida
- Applicant: Makoto Nagai , Setsuo Yada , Atsushi Uchida
- Applicant Address: JP Aichi
- Assignee: NGK Spark Plug Co., Ltd.
- Current Assignee: NGK Spark Plug Co., Ltd.
- Current Assignee Address: JP Aichi
- Agency: Sughrue Mion, PLLC
- Priority: JPP.2004-353574 20041207
- Main IPC: H01L27/15
- IPC: H01L27/15 ; H01L33/00

Abstract:
A wiring substrate for mounting a light emitting element, comprising: a substrate body comprising an insulating material and having a first surface and a back surface; and a cavity being opened into the first surface of said substrate body and having a mounting area for mounting a light emitting element at a bottom face of said cavity, wherein a metalized layer provided along a side face of said cavity and metalized layers provided in said substrate body are provided to continue to each other.
Public/Granted literature
- US20060118804A1 Wiring substrate for mounting light emitting element Public/Granted day:2006-06-08
Information query
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