Invention Grant
- Patent Title: Optical semiconductor device and method for manufacturing optical semiconductor device
- Patent Title (中): 光半导体装置及其制造方法
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Application No.: US11854280Application Date: 2007-09-12
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Publication No.: US07683394B2Publication Date: 2010-03-23
- Inventor: Taizo Tomioka
- Applicant: Taizo Tomioka
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JPP2006-257740 20060922
- Main IPC: H01L29/227
- IPC: H01L29/227 ; H01L29/207
Abstract:
An optical semiconductor device includes: a base substrate which has a concave portion; a light-emitting element which is provided in the concave portion, and which emits light; a prevention member which is provided to the base substrate in a manner of covering a side surface of the concave portion, and which prevents the light emitted by the light-emitting element from being incident on the side surface of the concave portion; and a translucent member which is provided in the concave portion, and which seals the light-emitting element.
Public/Granted literature
- US20080210964A1 OPTICAL SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING OPTICAL SEMICONDUCTOR DEVICE Public/Granted day:2008-09-04
Information query
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