Invention Grant
US07683403B2 Spatially aware drive strength dependent die size independent combinatorial spare cell insertion manner and related system and method
有权
空间感知驱动强度依赖芯片尺寸独立组合备用单元插入方式及相关系统和方法
- Patent Title: Spatially aware drive strength dependent die size independent combinatorial spare cell insertion manner and related system and method
- Patent Title (中): 空间感知驱动强度依赖芯片尺寸独立组合备用单元插入方式及相关系统和方法
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Application No.: US12057758Application Date: 2008-03-28
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Publication No.: US07683403B2Publication Date: 2010-03-23
- Inventor: Anshuman Tripathi
- Applicant: Anshuman Tripathi
- Applicant Address: US TX Carrollton
- Assignee: STMicroelectronics, Inc.
- Current Assignee: STMicroelectronics, Inc.
- Current Assignee Address: US TX Carrollton
- Agent Lisa K. Jorgenson; William J. Kubida
- Main IPC: H01L29/76
- IPC: H01L29/76 ; G06F17/50

Abstract:
A design method for an integrated circuit adds spare cells in a System-on-Chip to allow for Engineering Change Orders (ECOs) to be performed at a later stage in the design. This method can be used to provide a second version of the chip having minimal alterations performed in a short cycle time. The spare cells can be divided into combinational and sequential cells. There is an optimum spread of combinational cells in the design for post placement repairs of the chip with just metal layer changes. The method takes into account the drive strength of the spare cells as the main factor in their placement on the chip.
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