Invention Grant
- Patent Title: Semiconductor device and method for fabricating the same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US12122487Application Date: 2008-05-16
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Publication No.: US07683441B2Publication Date: 2010-03-23
- Inventor: Eun Jong Shin
- Applicant: Eun Jong Shin
- Applicant Address: KR Seoul
- Assignee: Dongbu Hitek Co., Ltd.
- Current Assignee: Dongbu Hitek Co., Ltd.
- Current Assignee Address: KR Seoul
- Agency: Saliwanchik, Lloyd & Saliwanchik
- Priority: KR10-2007-0047981 20070517
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L21/336

Abstract:
Provided are a semiconductor device and a method for fabricating the same. The semiconductor device can include a transistor structure, including a gate dielectric on a substrate, a gate electrode on the gate dielectric, a spacer at sidewalls of the gate electrode, and source/drain regions in the substrate; and an interlayer dielectric on the transistor structure where an air gap is provided in a region between the spacer, the interlayer dielectric, and the source/drain region of the substrate.
Public/Granted literature
- US20080283937A1 Semiconductor Device and Method for Fabricating the Same Public/Granted day:2008-11-20
Information query
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