Enhanced permeability device structures and method

Invention Grant

US07683445B2 Enhanced permeability device structures and method 失效

Title translation: 增强渗透性装置结构和方法

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Patent Title: Enhanced permeability device structures and method
Patent Title (中): 增强渗透性装置结构和方法
Application No.: US11740066

Application Date: 2007-04-25
Publication No.: US07683445B2

Publication Date: 2010-03-23
Inventor: Srinivas V. Pietambaram , Nicholas D. Rizzo , Jon M. Slaughter
Applicant: Srinivas V. Pietambaram , Nicholas D. Rizzo , Jon M. Slaughter
Applicant Address: US AZ Chandler
Assignee: Everspin Technologies, Inc.
Current Assignee: Everspin Technologies, Inc.
Current Assignee Address: US AZ Chandler
Agency: Ingrassia Fisher & Lorenz, P.C.
Main IPC: H01L29/82
IPC: H01L29/82

Enhanced permeability device structures and method

Abstract:

Low power magnetoelectronic device structures and methods therefore are provided. The magnetoelectronic device structure (100, 150, 450, 451) comprises a programming line (104, 154, 156, 454, 456), a magnetoelectronic device (102, 152, 452) magnetically coupled to the programming line (104, 154, 156, 454, 456), and an enhanced permeability dielectric (EPD) material (106, 108, 110, 158, 160, 162, 458, 460, 462) disposed adjacent the magnetoelectronic device. The EPD material (106, 108, 110, 158, 160, 162, 458, 460, 462) comprises multiple composite layers (408) of magnetic nano-particles (406) embedded in a dielectric matrix (409). The composition of the composite layers is chosen to provide a predetermined permeability profile. A method for making a magnetoelectronic device structure is also provided. The method comprises fabricating the magnetoelectronic device (102, 152, 452) and depositing the programming line (104, 154, 156, 454, 456). The EPD material (106, 108, 110, 158, 160, 162, 458, 460, 462) comprising the multiple composite layers (408) is formed around the magnetoelectronic device (102, 152, 452) and/or between the device (102, 152, 452) and the programming line (104, 154, 156, 454, 456). The presence of the EPD structure (470, 480, 490) in proximity to the programming line (104, 154, 156, 454, 456) and/or the magnetoelectronic device (102, 152, 452) reduces the required programming current.

Abstract(Chinese):

因此提供了低功率磁电子器件结构和方法。磁电子器件结构（100,150,450,451）包括编程线（104,154,156,454,456），磁耦合到编程线（104,154,452）的磁电子器件（102,152,452） 156,454,456）以及邻近磁电子器件设置的增强磁导率电介质（EPD）材料（106,108,110,158,160,162,458,460,462）。 EPD材料（106,108,110,158,160,162,458,460,462）包括嵌入电介质矩阵（409）中的磁性纳米颗粒（406）的多个复合层（408）。选择复合层的组成以提供预定的渗透率分布。还提供了一种制造磁电子器件结构的方法。该方法包括制造磁电子器件（102,152,452）并沉积编程线（104,154,156,454,456）。包括多个复合层（408）的EPD材料（106,108,110,158,160,162,458,460,462）形成在磁电子器件（102,152,452）周围和/或在器件（ 102，152,452）和编程线（104,154,156,454,465）。靠近编程线（104,154,156,454,465）和/或磁电子器件（102,152,452）的EPD结构（470,480,490）的存在减少了所需的编程电流。

Public/Granted literature

US20070284683A1 ENHANCED PERMEABILITY DEVICE STRUCTURES AND METHOD Public/Granted day:2007-12-13

Information query

Espacenet

IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L29/00	专门适用于整流、放大、振荡或切换，并具有至少一个电位跃变势垒或表面势垒的半导体器件；具有至少一个电位跃变势垒或表面势垒，例如PN结耗尽层或载流子集结层的电容器或电阻器；半导体本体或其电极的零部件（H01L31/00至H01L47/00，H01L51/05优先；除半导体或其电极之外的零部件入H01L23/00；由在一个共用衬底内或其上形成的多个固态组件组成的器件入H01L27/00）
H01L29/66	.按半导体器件的类型区分的
H01L29/82	..通过施加于器件的磁场变化可控的（H01L29/96优先）