Module with a shielding and/or heat dissipating element

Invention Grant

US07683460B2 Module with a shielding and/or heat dissipating element 有权

Title translation: 具有屏蔽和/或散热元件的模块

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Patent Title: Module with a shielding and/or heat dissipating element
Patent Title (中): 具有屏蔽和/或散热元件的模块
Application No.: US11534374

Application Date: 2006-09-22
Publication No.: US07683460B2

Publication Date: 2010-03-23
Inventor: Ludwig Heitzer , Christian Stümpfl , Michael Bauer
Applicant: Ludwig Heitzer , Christian Stümpfl , Michael Bauer
Applicant Address: DE Munich
Assignee: Infineon Technologies AG
Current Assignee: Infineon Technologies AG
Current Assignee Address: DE Munich
Agency: Banner & Witcoff, Ltd.
Main IPC: H01L23/552
IPC: H01L23/552

Module with a shielding and/or heat dissipating element

Abstract:

A module (100) comprises a component (10) and a shielding element (11), which is mounted on a main surface (12) of the component (10) and has a welding contact (13).

Abstract(Chinese):

模块（100）包括安装在部件（10）的主表面（12）上并具有焊接接头（13）的部件（10）和屏蔽元件（11）。

Public/Granted literature

US20080073756A1 Module with a shielding and/or heat dissipating element Public/Granted day:2008-03-27

Information query

Espacenet

IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L23/00	半导体或其他固态器件的零部件（H01L25/00优先）
H01L23/552	.防辐射保护装置，例如光