Invention Grant
- Patent Title: Integrated circuit leadless package system
- Patent Title (中): 集成电路无引线封装系统
-
Application No.: US11459320Application Date: 2006-07-21
-
Publication No.: US07683461B2Publication Date: 2010-03-23
- Inventor: Keng Kiat Lau
- Applicant: Keng Kiat Lau
- Applicant Address: SG Singapore
- Assignee: Stats Chippac Ltd.
- Current Assignee: Stats Chippac Ltd.
- Current Assignee Address: SG Singapore
- Agent Mikio Ishimaru
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/28
Abstract:
An integrated circuit leadless package system includes forming a lead, attaching an integrated circuit die to the lead, and applying an encapsulant including a thin encapsulant region with a thinner section over the lead than a section over the integrated circuit die.
Public/Granted literature
- US20080096401A1 INTEGRATED CIRCUIT LEADLESS PACKAGE SYSTEM Public/Granted day:2008-04-24
Information query
IPC分类:
