Invention Grant
- Patent Title: Etched leadframe structure including recesses
- Patent Title (中): 蚀刻引线框架结构包括凹槽
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Application No.: US11737630Application Date: 2007-04-19
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Publication No.: US07683463B2Publication Date: 2010-03-23
- Inventor: Lay Yeap Lim
- Applicant: Lay Yeap Lim
- Applicant Address: US ME South Portland
- Assignee: Fairchild Semiconductor Corporation
- Current Assignee: Fairchild Semiconductor Corporation
- Current Assignee Address: US ME South Portland
- Agency: Townsend and Townsend and Crew LLP
- Main IPC: H01L23/495
- IPC: H01L23/495
Abstract:
A leadframe structure is disclosed. The leadframe structure includes a first leadframe structure portion with a first thin portion and a first thick portion, where the first thin portion is defined in part by a first recess. It also includes a second leadframe structure portion with a second thin portion and a second thick portion, where the second thin portion is defined in part by a second recess. The first thin portion faces the second recess, and the second thin portion faces the first recess.
Public/Granted literature
- US20080258272A1 ETCHED LEADFRAME STRUCTURE Public/Granted day:2008-10-23
Information query
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