Invention Grant
US07683477B2 Semiconductor device including semiconductor chips having contact elements
有权
包括具有接触元件的半导体芯片的半导体器件
- Patent Title: Semiconductor device including semiconductor chips having contact elements
- Patent Title (中): 包括具有接触元件的半导体芯片的半导体器件
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Application No.: US11768587Application Date: 2007-06-26
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Publication No.: US07683477B2Publication Date: 2010-03-23
- Inventor: Ralf Otremba
- Applicant: Ralf Otremba
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Dicke, Billig & Czaja, PLLC
- Main IPC: H01L23/34
- IPC: H01L23/34 ; H01L23/053 ; H01L23/12 ; H01L23/02 ; H01L23/20 ; H01L23/16 ; H01L23/58 ; H01L23/06 ; H01L23/48 ; H01L23/52
Abstract:
A semiconductor device is disclosed. One embodiment provides a device including a carrier, an electrically insulating layer arranged over the carrier and a first semiconductor chip arranged over the electrically insulating layer, wherein the first semiconductor chip has a first contact element on a first surface and a second contact element on a second surface.
Public/Granted literature
- US20090001554A1 SEMICONDUCTOR DEVICE Public/Granted day:2009-01-01
Information query
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