中科微点-全球专利检索

  1. Login
  2. Sign Up
Invention Grant
US07683483B2 Electronic device with connection bumps 有权
带连接凸块的电子设备

Electronic device with connection bumps
Abstract:
Flip-chip electronic devices (40, 70, 80, 90) employ bumps (42, 72, 82) for coupling to an external substrate. Device cells (43, 73, 83, 93) and bumps (42, 72, 82) are preferably arranged in clusters (46) where four bumps (42, 72, 82) substantially surround each device cell (43, 73, 83, 93) or form a cross with the device cell (43, 73, 83, 93) at the intersection of the cross. The bumps (42, 72, 82) are desirably spaced apart by the minimum allowable bump (42, 72, 82) pitch (Lm). Typically, each device cell (43, 73, 83, 93) contains one or more active device regions (44, 74, 86, 96) depending on the overall function. Complex devices (40, 70) are formed by an X-Y array of the clusters (46), where adjacent clusters (46) may share bumps (43, 73, 83, 93) and/or device cells (43, 73, 83, 93). In a preferred embodiment, the bumps (42, 82) form the outer perimeter (48) of the device (40, 80, 90). The maximum device temperature and overall noise is reduced.
Abstract(Chinese):

倒装芯片电子器件（40,70,80,90）使用用于耦合到外部衬底的凸块（42,72,82）。 装置单元（43,73,83,93）和凸块（42,72,82）优选地布置成簇（46），其中四个凸块（42,72,82）基本上围绕每个器件单元（43,73,83） 93）或与十字交叉点处的设备单元（43,73,83,93）形成十字。 凸起（42,72,82）期望地间隔开最小允许凸起（42,72,82）间距（Lm）。 通常，取决于整个功能，每个设备单元（43,43,83,93）包含一个或多个有源器件区域（44,47,86,96）。 复数器件（40,70）由簇（46）的XY阵列形成，其中相邻的簇（46）可共享凸块（43,43,83,93）和/或器件单元（43,43,83， 93）。 在优选实施例中，凸块（42,82）形成装置（40,80,90）的外周边（48）。 最大器件温度和总噪声降低。

Public/Granted literature
Information query
Espacenet
Patent Agency Ranking
0/0