Invention Grant
US07683484B2 Bump structure, method of forming bump structure, and semiconductor apparatus using the same
失效
凸起结构，凸块结构的形成方法以及使用其的半导体装置
- Patent Title: Bump structure, method of forming bump structure, and semiconductor apparatus using the same
- Patent Title (中): 凸起结构，凸块结构的形成方法以及使用其的半导体装置
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Application No.: US11790143Application Date: 2007-04-24
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Publication No.: US07683484B2Publication Date: 2010-03-23
- Inventor: Yuji Yano , Kazuo Tamaki
- Applicant: Yuji Yano , Kazuo Tamaki
- Applicant Address: JP Osaka
- Assignee: Sharp Kabushiki Kaisha
- Current Assignee: Sharp Kabushiki Kaisha
- Current Assignee Address: JP Osaka
- Agency: Nixon & Vanderhye, PC
- Priority: JP2006-127813 20060501
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
A bump structure includes a squashed ball provided on an electrode pad, and a wire provided on the squashed ball. The wire is a wire loop that is loop-shaped and is formed so as to protrude from an end part of the squashed ball. This provides high bonding reliability between a bonding pad and the bump structure.
Public/Granted literature
- US20070252272A1 Bump structure, method of forming bump structure, and semiconductor apparatus using the same Public/Granted day:2007-11-01
Information query
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