Invention Grant
- Patent Title: Light-emitting apparatus, method of manufacturing light-emitting apparatus, image forming apparatus, and electronic apparatus
- Patent Title (中): 发光装置,制造发光装置的方法,图像形成装置和电子装置
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Application No.: US11468452Application Date: 2006-08-30
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Publication No.: US07683540B2Publication Date: 2010-03-23
- Inventor: Takayuki Tajima , Hiroyuki Tatsugi , Takanori Takeshita
- Applicant: Takayuki Tajima , Hiroyuki Tatsugi , Takanori Takeshita
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oliff & Berridge, PLC
- Priority: JP2005-279248 20050927
- Main IPC: H01J1/62
- IPC: H01J1/62

Abstract:
There is provided a light-emitting apparatus formed by attaching a device substrate where light-emitting device is formed and a sealing substrate which seals the device substrate through a sealing material and sealing the light-emitting device between the device substrate and the sealing substrate through the sealing material, wherein the sealing material includes a first sealing material and a second sealing material, wherein the first sealing material is formed to surround the light-emitting device between the device substrate and the sealing substrate and to have a sealing hole portion formed by not disposing the first sealing material, so that the first sealing material is discontinuous, wherein the sealing hole portion of the first sealing material is closed with the second sealing material, so that the second sealing material and the first sealing material constitute a ring-shaped sealing member, and wherein the first sealing material is provided with guide portions which are formed to be continuous with at least one side where the sealing hole portion is formed and to extend to an inner surface of the device substrate without being covered with the sealing substrate so as to be exposed.
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