Invention Grant
- Patent Title: High-speed low-power integrated circuit interconnects
- Patent Title (中): 高速低功耗集成电路互连
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Application No.: US11421457Application Date: 2006-05-31
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Publication No.: US07683670B2Publication Date: 2010-03-23
- Inventor: Zhibin Cheng , Satyajit Dutta , Peter J. Klim
- Applicant: Zhibin Cheng , Satyajit Dutta , Peter J. Klim
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Schubert Osterrieder & Nickelson PLLC
- Agent Mark E. McBurney
- Main IPC: H03K19/0175
- IPC: H03K19/0175 ; H03K19/094

Abstract:
Embodiments that decrease power consumption of interconnecting devices in integrated circuits are disclosed. Embodiments reduce power consumption in integrated circuits by generating full and reduced swing signals at an output of a driver module in response to a control signal during and deactivating one or more elements to conserve power after an input signal remains unchanged for a period of time. Another embodiment reduces power consumption in a circuit, the embodiment comprising a swing module coupled with a swing selector and an output controller. The swing module may generate full or low swing signals depending on the state of the swing selector. The output controller may increase the output impedance of the swing module after an input signal to the swing module remains unchanged for a quantity of time. Various apparatus embodiments include portable computing devices and cellular telephones.
Public/Granted literature
- US20070279097A1 HIGH-SPEED LOW-POWER INTEGRATED CIRCUIT INTERCONNECTS Public/Granted day:2007-12-06
Information query
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