Invention Grant
- Patent Title: Electronic component and method for manufacturing same
- Patent Title (中): 电子部件及其制造方法
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Application No.: US11878452Application Date: 2007-07-24
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Publication No.: US07683740B2Publication Date: 2010-03-23
- Inventor: Toshiyuki Yoshizawa , Masahiro Miyazaki , Akira Furuya , Masaomi Ishikura , Hajime Kuwajima
- Applicant: Toshiyuki Yoshizawa , Masahiro Miyazaki , Akira Furuya , Masaomi Ishikura , Hajime Kuwajima
- Applicant Address: JP Tokyo
- Assignee: TDK Corporation
- Current Assignee: TDK Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oliff & Berridge, PLC
- Priority: JP2006-206365 20060728
- Main IPC: H03H7/01
- IPC: H03H7/01

Abstract:
An electronic component having: a substrate, a lower conductor layer provided on the substrate; an inorganic dielectric film that covers the lower conductor layer; and an upper conductor layer having an upper electrode portion provided on the inorganic dielectric film. The lower conductor layer has a lower electrode portion that together with the upper electrode portion and the inorganic dielectric film constitutes a capacitor, and a coil portion that constitutes an inductor. The entire inorganic dielectric film is formed integrally, and the lower conductor layer is in contact only with the substrate, inorganic dielectric film, and upper conductor layer.
Public/Granted literature
- US20080023219A1 Electronic component and method for manufacturing same Public/Granted day:2008-01-31
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