This visual inspection apparatus has a macro-inspection section and a micro-inspection section. In the micro-inspection section, a inspection stage and a microscope are loaded into a loading plate. The inspection stage can be moved in any directions of the X, Y, and Z directions, and can also be rotated in the θ direction. Moreover, a peripheral edge inspection section that acquires an enlarged image of a peripheral edge of wafer W is fixed to the loading plate. The peripheral edge inspection section is arranged so as to image the peripheral edge of wafer W held by the inspection stage.