Invention Grant
- Patent Title: Electronic component mounting apparatus, height detection method for electronic component, and optical-axis adjustment method for component height detection unit
- Patent Title (中): 电子部件安装装置,电子部件的高度检测方法以及部件高度检测部的光轴调整方法
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Application No.: US11994618Application Date: 2006-06-29
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Publication No.: US07684061B2Publication Date: 2010-03-23
- Inventor: Masanori Hiyoshi , Hidehiro Saho , Noboru Yamasaki , Tadashi Endo
- Applicant: Masanori Hiyoshi , Hidehiro Saho , Noboru Yamasaki , Tadashi Endo
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP2005-199876 20050708; JP2005-245643 20050826; JP2005-248976 20050830
- International Application: PCT/JP2006/313441 WO 20060629
- International Announcement: WO2007/007623 WO 20070118
- Main IPC: G01B11/06
- IPC: G01B11/06 ; G01B11/02

Abstract:
An electronic component mounting apparatus includes a beam projector for projecting a laser beam, a beam receiver which is placed in opposition to the beam projector and which receives a laser beam projected from the beam projector, a light-reception-sensitivity setting unit for adjusting light-reception sensitivity of the beam receiver, a projection-side orifice provided in the beam projector to narrow a projection spot diameter of the laser beam, and a reception-side orifice provided in the beam receiver to narrow a light-reception spot diameter, where the light-reception sensitivity of the beam receiver is improved. As a result, an electronic component mounting apparatus capable of accurately detecting height size of small components by using a relatively inexpensive photoelectric sensor can be provided.
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