Invention Grant
- Patent Title: MEMS using filler material and method
- Patent Title (中): MEMS采用填充材料和方法
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Application No.: US11208809Application Date: 2005-08-22
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Publication No.: US07684104B2Publication Date: 2010-03-23
- Inventor: Clarence Chui , Jeffrey B. Sampsell
- Applicant: Clarence Chui , Jeffrey B. Sampsell
- Applicant Address: US CA Pleasanton
- Assignee: IDC, LLC
- Current Assignee: IDC, LLC
- Current Assignee Address: US CA Pleasanton
- Agency: Knobbe, Martens, Olson & Bear, LLP
- Main IPC: G02B26/00
- IPC: G02B26/00

Abstract:
Described is an apparatus, method for manufacturing, and systems comprising a MEMS device, for example, an interferometric modulator, comprising a substrate, a movable mirror, a deformable layer, and a support structure. In some embodiments, the support structure comprises a plurality of support posts. A connector secures the movable mirror secured to the deformable layer. At least one of the connector and the support post is a composite comprising a first component and a second component, where at the first component forms at least a portion of at least one of the perimeter of the connector and support post.
Public/Granted literature
- US20060066936A1 Interferometric optical modulator using filler material and method Public/Granted day:2006-03-30
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