Invention Grant
- Patent Title: Cooling system for electronics housing
- Patent Title (中): 电子外壳冷却系统
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Application No.: US11997750Application Date: 2006-06-21
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Publication No.: US07684195B2Publication Date: 2010-03-23
- Inventor: Nikolaus Kerner , Christian Weinzierl
- Applicant: Nikolaus Kerner , Christian Weinzierl
- Applicant Address: DE Munich
- Assignee: Siemens VDO Automotive AG
- Current Assignee: Siemens VDO Automotive AG
- Current Assignee Address: DE Munich
- Agent Laurence A. Greenberg; Werner H. Stemer; Ralph E. Locher
- Priority: DE102005036299 20050802
- International Application: PCT/EP2006/063417 WO 20060621
- International Announcement: WO2007/014801 WO 20070208
- Main IPC: H05K7/20
- IPC: H05K7/20
Abstract:
A cooling system through which liquid flows for carrying away waste heat for electronics housings is particularly suited for the automotive industry. The cooling system is adapted to the dimensions of the housing. The novel device is the first to create an effective cooling system for electronics housings with and for a number of circuit board levels, yet with a space-saving compact design.
Public/Granted literature
- US20080212281A1 Cooling System for Electronics Housing Public/Granted day:2008-09-04
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