Invention Grant
- Patent Title: Enhancing the cooling of dual in-line memory modules
- Patent Title (中): 加强双列直插式内存模块的冷却
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Application No.: US12119857Application Date: 2008-05-13
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Publication No.: US07684196B2Publication Date: 2010-03-23
- Inventor: Eric Alan Eckberg , Maurice Francis Holahan
- Applicant: Eric Alan Eckberg , Maurice Francis Holahan
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Dillon & Yudell LLP
- Agent Robert R. Williams
- Main IPC: H05K7/20
- IPC: H05K7/20
Abstract:
An apparatus for enhancing the cooling of a dual in-line memory module (DIMM) includes a planar body having opposing surfaces, a top edge, a bottom edge, and opposing ends. An engagement flange is connected to the bottom edge of the body. A first clip leg is connected to the engagement flange. The first clip leg includes a tab arranged to engage one mounting latch recess of the DIMM. A second clip leg connected to the engagement flange. The second clip leg includes a tab arranged to engage the other mounting latch recess of the DIMM.
Public/Granted literature
- US20090284928A1 Enhancing the Cooling of Dual In-Line Memory Modules Public/Granted day:2009-11-19
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