To enable the mounting of a multifunctional vibrating actuator on the surface of a circuit board by solder reflow without exposing the components with poor heat resistance the diaphragm, magnet, and voice coil—to the high temperatures of the reflow tank, the structure for mounting a multifunctional vibrating actuator on a circuit board is constituted such that a bracket is fixed to the surface of the circuit board by solder reflow, and then the housing of the multifunctional vibrating actuator is placed in the bracket so that the terminals of the multifunctional vibrating actuator are electrically connected to the electrodes of the circuit board.