Invention Grant
- Patent Title: Printed circuit board engagement assembly
- Patent Title (中): 印刷电路板接合组件
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Application No.: US11880528Application Date: 2007-07-23
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Publication No.: US07684209B2Publication Date: 2010-03-23
- Inventor: Arlen L. Roesner
- Applicant: Arlen L. Roesner
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Main IPC: H05K7/12
- IPC: H05K7/12
Abstract:
In one embodiment a computer system comprises a housing, a backplane coupled to the housing, and at least one floor plate comprising an engagement assembly to connect a printed circuit board assembly to the backplane, wherein the engagement assembly utilizes a single mechanical force lever to secure the printed circuit board assembly to the backplane.
Public/Granted literature
- US20090027843A1 Printed circuit board engagement assembly Public/Granted day:2009-01-29
Information query
