Invention Grant
US07684226B2 Method of making high forward current diodes for reverse write 3D cell
有权
制造反向写入3D电池的高正向电流二极管的方法
- Patent Title: Method of making high forward current diodes for reverse write 3D cell
- Patent Title (中): 制造反向写入3D电池的高正向电流二极管的方法
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Application No.: US11819079Application Date: 2007-06-25
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Publication No.: US07684226B2Publication Date: 2010-03-23
- Inventor: S. Brad Herner
- Applicant: S. Brad Herner
- Applicant Address: US CA Milpitas
- Assignee: Sandisk 3D LLC
- Current Assignee: Sandisk 3D LLC
- Current Assignee Address: US CA Milpitas
- Agency: Foley & Lardner LLP
- Main IPC: G11C17/00
- IPC: G11C17/00

Abstract:
A method of making a nonvolatile memory device includes forming a first electrode, forming at least one nonvolatile memory cell including a diode and a metal oxide antifuse dielectric layer over the first electrode, and forming a second electrode over the at least one nonvolatile memory cell. In use, the diode acts as a read/write element of the nonvolatile memory cell by switching from a first resistivity state to a second resistivity state different from the first resistivity state in response to an applied bias.
Public/Granted literature
- US20080316796A1 Method of making high forward current diodes for reverse write 3D cell Public/Granted day:2008-12-25
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