Invention Grant
US07684226B2 Method of making high forward current diodes for reverse write 3D cell 有权
制造反向写入3D电池的高正向电流二极管的方法

  • Patent Title: Method of making high forward current diodes for reverse write 3D cell
  • Patent Title (中): 制造反向写入3D电池的高正向电流二极管的方法
  • Application No.: US11819079
    Application Date: 2007-06-25
  • Publication No.: US07684226B2
    Publication Date: 2010-03-23
  • Inventor: S. Brad Herner
  • Applicant: S. Brad Herner
  • Applicant Address: US CA Milpitas
  • Assignee: Sandisk 3D LLC
  • Current Assignee: Sandisk 3D LLC
  • Current Assignee Address: US CA Milpitas
  • Agency: Foley & Lardner LLP
  • Main IPC: G11C17/00
  • IPC: G11C17/00
Method of making high forward current diodes for reverse write 3D cell
Abstract:
A method of making a nonvolatile memory device includes forming a first electrode, forming at least one nonvolatile memory cell including a diode and a metal oxide antifuse dielectric layer over the first electrode, and forming a second electrode over the at least one nonvolatile memory cell. In use, the diode acts as a read/write element of the nonvolatile memory cell by switching from a first resistivity state to a second resistivity state different from the first resistivity state in response to an applied bias.
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