Invention Grant
- Patent Title: Splice chip device
- Patent Title (中): 接头芯片器件
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Application No.: US12313510Application Date: 2008-11-19
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Publication No.: US07684669B2Publication Date: 2010-03-23
- Inventor: Yilmaz Bayazit , Chad Raskovich , Oscar Bran De Leon
- Applicant: Yilmaz Bayazit , Chad Raskovich , Oscar Bran De Leon
- Applicant Address: US MN Eden Prairie
- Assignee: ADC Telecommunications, Inc.
- Current Assignee: ADC Telecommunications, Inc.
- Current Assignee Address: US MN Eden Prairie
- Agency: Merchant & Gould P.C.
- Main IPC: G02B6/00
- IPC: G02B6/00

Abstract:
A splice tray arrangement including a tray and a splice chip. The splice chip includes a plurality of arms that define channels for holding splice elements. The arms include retaining structure for retaining a splice element in both of either one of an upper region and a lower region of a channel. The splice tray arrangement also includes a mounting arrangement for securing the splice chip to the tray at a mounting location. The mounting arrangement includes sliding interlock guides disposed on each of the splice chip and the tray. The mounting arrangement further includes flexible tabs arranged to prevent lateral movement of the splice chip when positioned at the mounting location.
Public/Granted literature
- US20090136185A1 Splice chip device Public/Granted day:2009-05-28
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