Invention Grant
US07686203B2 Direct application of pressure for bonding porous coatings to substrate materials used in orthopaedic implants
有权
直接施加用于将多孔涂层粘合到用于矫形植入物的基底材料上的压力
- Patent Title: Direct application of pressure for bonding porous coatings to substrate materials used in orthopaedic implants
- Patent Title (中): 直接施加用于将多孔涂层粘合到用于矫形植入物的基底材料上的压力
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Application No.: US11681268Application Date: 2007-03-02
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Publication No.: US07686203B2Publication Date: 2010-03-30
- Inventor: Brad L. Rauguth , William G. Hutchison , Clarence M. Panchison
- Applicant: Brad L. Rauguth , William G. Hutchison , Clarence M. Panchison
- Applicant Address: US IN Warsaw
- Assignee: Zimmer Technology, Inc.
- Current Assignee: Zimmer Technology, Inc.
- Current Assignee Address: US IN Warsaw
- Agency: Baker & Daniels LLP
- Main IPC: B23K37/00
- IPC: B23K37/00 ; A61F2/02
Abstract:
A method for constantly controlling a direct application of pressure for bonding porous coatings to substrate materials used in orthopaedic implants. The direct pressure is applied to an interface between the porous coating and the substrate material via a pressure application mechanism unaffected by heat and air pressure conditions of the bonding process. The pressure application mechanism maintains a pressure on the implant which is constantly controlled throughout the bonding process.
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