Invention Grant
- Patent Title: Wire bonding apparatus, record medium storing bonding control program, and bonding method
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Application No.: US11645943Application Date: 2006-12-27
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Publication No.: US07686204B2Publication Date: 2010-03-30
- Inventor: Kuniyuki Takahashi , Shinsuke Tei , Noriko Suzuki , Noriko Mori , Shinji Maki
- Applicant: Kuniyuki Takahashi , Shinsuke Tei , Noriko Suzuki , Noriko Mori , Shinji Maki
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Shinkawa
- Current Assignee: Kabushiki Kaisha Shinkawa
- Current Assignee Address: JP Tokyo
- Agent William L. Androlia; H. Henry Koda
- Priority: JP2005-378440 20051228
- Main IPC: B23K31/02
- IPC: B23K31/02 ; B23K37/00
Abstract:
A wire bonding apparatus including a bonding control section provided with an electrical non-bonding detector, an optical non-bonding detector, and an optical shape detector, which are for detecting non-bonding between a first bonding point and a bonding wire; and when non-bonding is detected by the electrical non-bonding detector and non-bonding is also detected by the optical non-bonding detector, then the tip end of the bonding wire is reformed by, based on the shape of the tip end of the bonding wire detected by the optical shape detector, a ball formation device into a ball of a prescribed shape, and rebonding is performed at the first bonding point.
Public/Granted literature
- US20070187138A1 Wire bonding apparatus, record medium storing bonding control program, and bonding method Public/Granted day:2007-08-16
Information query
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