Invention Grant
- Patent Title: High speed modular jack with flexible compensation circuit
- Patent Title (中): 高速模块插座,灵活的补偿电路
-
Application No.: US11748709Application Date: 2007-05-15
-
Publication No.: US07686650B2Publication Date: 2010-03-30
- Inventor: Yakov Belopolsky , David Blankenship , David Gutter , Richard Marowsky
- Applicant: Yakov Belopolsky , David Blankenship , David Gutter , Richard Marowsky
- Applicant Address: HK San Po Kong, Kowloon
- Assignee: Bel Fuse Ltd.
- Current Assignee: Bel Fuse Ltd.
- Current Assignee Address: HK San Po Kong, Kowloon
- Agent Cozen O'Connor
- Main IPC: H01R13/68
- IPC: H01R13/68

Abstract:
A jack capable of handling both Category 6 and Category 7 speed communications. The jack includes a shield, a housing disposed in the shield and a contact block disposed in the housing. The contact block includes a base member and a plurality of contacts carried by the base member. Each contact includes a contact portion effective to touch a corresponding contact of a plug when the plug is inserted into the jack, a first end portion effective to be inserted into a circuit board, and a second end portion. A flexible substrate is connected to the second end portion, the substrate including a compensation circuit for the jack.
Public/Granted literature
- US20070270042A1 High Speed Modular Jack With Flexible Compensation Circuit Public/Granted day:2007-11-22
Information query