Invention Grant
- Patent Title: Sensor apparatus
- Patent Title (中): 传感器装置
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Application No.: US11469634Application Date: 2006-09-01
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Publication No.: US07686651B2Publication Date: 2010-03-30
- Inventor: Izuru Shinjo
- Applicant: Izuru Shinjo
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2006-116878 20060420
- Main IPC: G01L7/00
- IPC: G01L7/00

Abstract:
The sensor module has four internal terminals that include a first ground terminal, a second ground terminal, an output signal terminal, and a power terminal, three external terminals are connected to the first ground terminal, the output signal terminal, and the power terminal, respectively, a sensor main body portion is obtained by molding the sensor module to which the external terminals are connected integrally in a insulating resin, and a connector connecting portion and a mount portion are molded integrally with the sensor module in this sensor main body portion. With this system, different orders of arrangement of the three external terminals may be formed while insuring that capacitors may be mounted between certain terminals without spanning other wiring patterns.
Public/Granted literature
- US20070247322A1 SENSOR APPARATUS Public/Granted day:2007-10-25
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