Invention Grant
- Patent Title: Electroless plating bath composition and method of use
- Patent Title (中): 化学镀浴组成及使用方法
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Application No.: US11168675Application Date: 2005-06-28
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Publication No.: US07686874B2Publication Date: 2010-03-30
- Inventor: Rita J. Klein , Adam J. Regner, III
- Applicant: Rita J. Klein , Adam J. Regner, III
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Dinsmore & Shohl LLP
- Main IPC: C23C18/34
- IPC: C23C18/34
Abstract:
An electroless plating composition comprising succinic acid, potassium carbonate, a source of cobalt metal ions, a reducing agent, and water is provided. An optional buffering agent may also be included in the composition. The composition may be used to deposit cobalt metal in or on semiconductor substrate surfaces including vias, trenches, and interconnects.
Public/Granted literature
- US20060292294A1 Electroless plating bath composition and method of use Public/Granted day:2006-12-28
Information query
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