Invention Grant
- Patent Title: Radiation-curable desiccant-filled adhesive/sealant
- Patent Title (中): 可辐射固化的干燥剂填充胶/密封剂
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Application No.: US11098117Application Date: 2005-04-04
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Publication No.: US07687119B2Publication Date: 2010-03-30
- Inventor: Jie Cao , Donald E. Herr
- Applicant: Jie Cao , Donald E. Herr
- Applicant Address: DE Düsseldorf
- Assignee: Henkel AG & Co. KGaA
- Current Assignee: Henkel AG & Co. KGaA
- Current Assignee Address: DE Düsseldorf
- Agent Jane E. Gennaro
- Main IPC: B32B7/12
- IPC: B32B7/12 ; C09K3/10 ; C09K3/00 ; C08F2/46 ; C08J3/28
Abstract:
A radiation-curable desiccant-filled adhesive/sealant composition comprising a radiation-curable resin, one or more desiccant fillers, one or more photoinitiators or photosensitizers, and optionally, one or more inorganic or organic fillers.
Public/Granted literature
- US20060223903A1 Radiation-curable desiccant-filled adhesive/sealant Public/Granted day:2006-10-05
Information query
