Invention Grant
- Patent Title: Semiconductor device and method of producing the same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US11798302Application Date: 2007-05-11
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Publication No.: US07687348B2Publication Date: 2010-03-30
- Inventor: Kouichi Tani
- Applicant: Kouichi Tani
- Applicant Address: JP Tokyo
- Assignee: Oki Semiconductor Co., Ltd.
- Current Assignee: Oki Semiconductor Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Kubotera & Associates, LLC
- Priority: JP2006-249669 20060914
- Main IPC: H01L21/336
- IPC: H01L21/336 ; H01L27/01

Abstract:
A semiconductor device includes a semiconductor substrate having an insulation layer and a semiconductor layer formed on the insulation layer; a channel area formed in the semiconductor layer; a gate electrode formed on the channel area; a source area formed in the semiconductor layer and having a depth not reaching the insulation layer; a drain area formed in the semiconductor layer adjacent to the source area with the channel area in between and having a depth reaching the insulation layer; a separation area disposed next to the source area opposite to the channel area and having a depth not reaching the insulation layer; a high-concentration body area formed in the semiconductor layer at lease in a surface layer thereof and between the first separation area and the second separation area; and a body contact disposed on the high-concentration body area.
Public/Granted literature
- US20080067591A1 Semiconductor device and method of producing the same Public/Granted day:2008-03-20
Information query
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