Invention Grant
- Patent Title: Dual cure adhesives
- Patent Title (中): 双固化胶
-
Application No.: US11470457Application Date: 2006-09-06
-
Publication No.: US07687551B2Publication Date: 2010-03-30
- Inventor: Alexander P. Mgaya , Balasubramaniam Ramalingam
- Applicant: Alexander P. Mgaya , Balasubramaniam Ramalingam
- Applicant Address: US CT Rocky Hill
- Assignee: Henkel Corporation
- Current Assignee: Henkel Corporation
- Current Assignee Address: US CT Rocky Hill
- Agent Sun Lee Lehmann
- Main IPC: C08F2/46
- IPC: C08F2/46 ; C08J3/28 ; C09J4/06

Abstract:
Adhesive compositions useful for laminating cellulosic substrates are formulated using an aqueous emulsion of a vinyl ester polymer such as polyvinyl acetate, one or more monomers or oligomers functionalized with (meth)acrylate groups, and a photoinitiator. The adhesive is cured by drying and exposing the adhesive to UV or visible light and is particularly useful for attaching clear films to cellulosic substrates such as paper and boxboard (e.g., in the manufacture of envelopes or folding cartons having windows).
Public/Granted literature
- US20070039688A1 DUAL CURE ADHESIVES Public/Granted day:2007-02-22
Information query