Invention Grant
- Patent Title: Via structures in solar cells with bypass diode
- Patent Title (中): 具有旁路二极管的太阳能电池通孔结构
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Application No.: US11280379Application Date: 2005-11-16
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Publication No.: US07687707B2Publication Date: 2010-03-30
- Inventor: Robert Meck , Paul R. Sharps
- Applicant: Robert Meck , Paul R. Sharps
- Applicant Address: US NM Albuquerque
- Assignee: Emcore Solar Power, Inc.
- Current Assignee: Emcore Solar Power, Inc.
- Current Assignee Address: US NM Albuquerque
- Main IPC: H01L31/00
- IPC: H01L31/00
Abstract:
A solar cell including a semiconductor body with a multijunction solar cell and an integral bypass diode, and a pair of vias extending between the upper and lower surfaces, forming determined on the lower surface and electrically coupling the anode of the bypass diode with the conductive grid on the upper surface.
Public/Granted literature
- US20070107772A1 Via structures in solar cells with bypass diode Public/Granted day:2007-05-17
Information query
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