An interconnection structure for circuit board and terminal members improves a configuration of a terminal member to be soldered to conductors on boards, and relaxes a stress applied to soldered portions, thereby preventing the soldered portions from a problem, such as cracking. An interconnection structure for circuit boards and terminal members includes two boards positioned away from each other. A terminal support base may be disposed on at least one of the boards and provided with a plurality of juxtaposed terminal guiding-holes, and a plurality of terminal members may be soldered to conductors on the two boards, may penetrate the terminal guiding-holes in the terminal support base, and may be provided with bent portions for stress relaxation at a position where the bent portions do not contact with the terminal support base.