Invention Grant
US07687724B2 Circuitized substrate with internal resistor, method of making said circuitized substrate, and electrical assembly utilizing said circuitized substrate
失效
具有内部电阻器的电路化衬底，制造所述电路化衬底的方法以及利用所述电路化衬底的电气组件
- Patent Title: Circuitized substrate with internal resistor, method of making said circuitized substrate, and electrical assembly utilizing said circuitized substrate
- Patent Title (中): 具有内部电阻器的电路化衬底，制造所述电路化衬底的方法以及利用所述电路化衬底的电气组件
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Application No.: US11806685Application Date: 2007-06-04
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Publication No.: US07687724B2Publication Date: 2010-03-30
- Inventor: Rabindra N. Das , Michael J. Rowlands
- Applicant: Rabindra N. Das , Michael J. Rowlands
- Applicant Address: US NY Endicott
- Assignee: Endicott Interconnect Technologies, Inc.
- Current Assignee: Endicott Interconnect Technologies, Inc.
- Current Assignee Address: US NY Endicott
- Agency: Hinman, Howard & Kattell
- Agent Mark Levy; Lawrence R. Fraley
- Main IPC: H01R12/04
- IPC: H01R12/04
Abstract:
A circuitized substrate which utilizes at least one internal (embedded) resistor as part thereof, the resistor comprised of a material including resin and a quantity of powders of nano-particle and/or micro-particle sizes. The resistor serves to decrease the capacitance in the formed circuit while only slightly increasing the high frequency resistance, thereby improving circuit performance through the substantial elimination of some discontinuities known to exist in structures like these. An electrical assembly (substrate and at least one electrical component) is also provided.
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