A packaging structure for depression switches includes an electronic substrate containing at least one switch electrode, a push-on switch located on the electronic substrate to connect the switch electrode to generate a command signal and a sealing member. The push-on switch and the electronic substrate form a first air chamber between them. The sealing member has a fastening portion to seal the push-on switch on the electronic substrate and a second air chamber formed with the electronic substrate to communicate with the first air chamber. By depressing the push-on switch to connect the switch electrode, air held in the first air chamber is squeezed and flows to the second air chamber without escaping.