Invention Grant
US07687801B2 Dopant material, dopant material manufacturing method, and semiconductor device using the same
失效
掺杂剂材料,掺杂剂材料制造方法和使用其的半导体器件
- Patent Title: Dopant material, dopant material manufacturing method, and semiconductor device using the same
- Patent Title (中): 掺杂剂材料,掺杂剂材料制造方法和使用其的半导体器件
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Application No.: US11325547Application Date: 2006-01-05
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Publication No.: US07687801B2Publication Date: 2010-03-30
- Inventor: Hidefumi Hiura , Tetsuya Tada , Toshihiko Kanayama
- Applicant: Hidefumi Hiura , Tetsuya Tada , Toshihiko Kanayama
- Applicant Address: JP Tokyo
- Assignee: National Institute of Advanced Industrial Science and Technology
- Current Assignee: National Institute of Advanced Industrial Science and Technology
- Current Assignee Address: JP Tokyo
- Agency: Foley & Lardner LLP
- Priority: JP2005-001422 20050106
- Main IPC: H01L35/24
- IPC: H01L35/24

Abstract:
It is to provide a thermodynamically and chemically stable dopant material which can achieve controls of the pn conduction types, carrier density, and threshold value of gate voltage, and a manufacturing method thereof. Further, it is to provide an actually operable semiconductor device such as a transistor with an excellent high-speed operability and high-integration characteristic. Provided is a dopant material obtained by depositing, on a carbon nanotube, a donor with a smaller ionization potential than an intrinsic work function of the carbon nanotube or an acceptor with a larger electron affinity than the intrinsic work function of the carbon nanotube. The ionization potential of the donor in vacuum is desired to be 6.4 eV or less, and the electron affinity of the acceptor in vacuum to be 2.3 eV or more.
Public/Granted literature
- US20100012923A1 DOPANT MATERIAL, DOPANT MATERIAL MANUFACTURING METHOD, AND SEMICONDUCTOR DEVICE USING THE SAME Public/Granted day:2010-01-21
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