Invention Grant
US07687866B2 Semiconductor device and method of manufacturing semiconductor device 失效
半导体装置及其制造方法

  • Patent Title: Semiconductor device and method of manufacturing semiconductor device
  • Patent Title (中): 半导体装置及其制造方法
  • Application No.: US11535850
    Application Date: 2006-09-27
  • Publication No.: US07687866B2
    Publication Date: 2010-03-30
  • Inventor: Juri Kato
  • Applicant: Juri Kato
  • Applicant Address: JP Tokyo
  • Assignee: Seiko Epson Corporation
  • Current Assignee: Seiko Epson Corporation
  • Current Assignee Address: JP Tokyo
  • Agency: Oliff & Berridge, PLC
  • Priority: JP2005-288881 20050930; JP2005-288882 20050930; JP2006-189025 20060710
  • Main IPC: H01L29/76
  • IPC: H01L29/76
Semiconductor device and method of manufacturing semiconductor device
Abstract:
A semiconductor device includes a semiconductor layer formed partially on a semiconductor substrate by epitaxial growth, an embedded oxide film embedded between the semiconductor substrate and the semiconductor layer, first and second gate electrodes disposed on sidewalls of the semiconductor layer, a source layer formed in the semiconductor layer and disposed in the first gate electrode, and a drain layer formed in the semiconductor layer and disposed in the second gate electrode, wherein the sidewalls of the semiconductor layer are film-forming surfaces of the epitaxial growth.
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