Invention Grant
US07687895B2 Workpiece with semiconductor chips and molding, semiconductor device and method for producing a workpiece with semiconductors chips
有权
具有半导体芯片和模制的工件，半导体器件和用于制造具有半导体芯片的工件的方法
- Patent Title: Workpiece with semiconductor chips and molding, semiconductor device and method for producing a workpiece with semiconductors chips
- Patent Title (中): 具有半导体芯片和模制的工件，半导体器件和用于制造具有半导体芯片的工件的方法
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Application No.: US11939938Application Date: 2007-11-14
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Publication No.: US07687895B2Publication Date: 2010-03-30
- Inventor: Markus Brunnbauer , Jens Pohl , Klaus Pressel , Thorsten Meyer , Recai Sezi , Stephan Bradl , Ralf Plieninger
- Applicant: Markus Brunnbauer , Jens Pohl , Klaus Pressel , Thorsten Meyer , Recai Sezi , Stephan Bradl , Ralf Plieninger
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Edell, Shapiro & Finnan, LLC
- Priority: DE102007020656 20070430
- Main IPC: H01L23/02
- IPC: H01L23/02 ; H01L23/043 ; H01L23/10 ; H01L23/34 ; H01L23/48 ; H01L23/52 ; H01L29/40 ; H01L23/28
Abstract:
A workpiece has at least two semiconductor chips, each semiconductor chip having a first main surface, which is at least partially exposed, and a second main surface. The workpiece also includes an electrically conducting layer, arranged on the at least two semiconductor chips, the electrically conducting layer being arranged at least on regions of the second main surface, and a molding compound, arranged on the electrically conducting layer. In the molding compound a contact via is arranged.
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