Invention Grant
- Patent Title: Power module and method of fabricating the same
- Patent Title (中): 电源模块及其制造方法
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Application No.: US12220638Application Date: 2008-07-24
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Publication No.: US07687903B2Publication Date: 2010-03-30
- Inventor: Joon-seo Son , Seung-won Lim , O-seob Jeon
- Applicant: Joon-seo Son , Seung-won Lim , O-seob Jeon
- Applicant Address: KR Bucheon-si, Gyeonggi-do
- Assignee: Fairchild Korea Semiconductor Ltd.
- Current Assignee: Fairchild Korea Semiconductor Ltd.
- Current Assignee Address: KR Bucheon-si, Gyeonggi-do
- Agency: Townsend and Townsend and Crew LLP
- Priority: KR10-2007-0117360 20071116
- Main IPC: H01L23/34
- IPC: H01L23/34

Abstract:
Provided are a power module including a power package and a control package that are provided separately and can be highly integrated, and method of fabricating the power module. The power module includes: a molded power package including at least one power device on a first lead frame; and a molded control package vertically stacked on the power package, and including at least one control device on a second lead frame. A first part of the first lead frame and a first part of the second lead frame are coupled to each other so that the power package and the control package can be electrically coupled to each other.
Public/Granted literature
- US20090129028A1 Power module and method of fabricating the same Public/Granted day:2009-05-21
Information query
IPC分类: