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US07687922B2 Element mounting structure and element mounting method 失效
元件安装结构和元件安装方法

  • Patent Title: Element mounting structure and element mounting method
  • Patent Title (中): 元件安装结构和元件安装方法
  • Application No.: US11871063
    Application Date: 2007-10-11
  • Publication No.: US07687922B2
    Publication Date: 2010-03-30
  • Inventor: Tadayuki Chikuma
  • Applicant: Tadayuki Chikuma
  • Priority: JP2006-324216 20061130
  • Main IPC: H01L29/41
  • IPC: H01L29/41 H01L23/12 H01L21/00 B23K31/00
Element mounting structure and element mounting method
Abstract:
An element is mounted on a carrier by removing an oxide film sufficiently. An element mounting method in which electrodes of the element are fusion bonded to electrodes of the carrier so that the element is mounted on the carrier, the method includes the steps of: positioning the electrodes of the element at electrodes of carrier respectively, one of the electrodes of the carrier being a striped electrode in an arc shape formed on a concentric circle centered on one of the electrodes of the element, and another being a center electrode formed near the center location of the concentric circle; and then rubbing the striped electrode of the carrier and an electrode of the element together in a direction of the concentric circle centered the center electrode so as to fusion bond the electrodes.
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