Invention Grant
- Patent Title: Compound body and a process for the production of a mechanical connection
- Patent Title (中): 复合体和生产机械连接的过程
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Application No.: US10537980Application Date: 2003-11-20
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Publication No.: US07687996B2Publication Date: 2010-03-30
- Inventor: Ingo Dünisch
- Applicant: Ingo Dünisch
- Applicant Address: DE Wiesbaden
- Assignee: PerkinElmer Optoelectronics GmbH & Co. KG
- Current Assignee: PerkinElmer Optoelectronics GmbH & Co. KG
- Current Assignee Address: DE Wiesbaden
- Agency: Wood, Herron & Evans, LLP
- Priority: DE10257477 20021209
- International Application: PCT/EP03/13022 WO 20031120
- International Announcement: WO2004/052800 WO 20040624
- Main IPC: H01J17/20
- IPC: H01J17/20
Abstract:
A compound body has a first body part (15) made of glass and a mechanical connection (20, 60) which is melted on the first body part (15) and contains aluminum.
Public/Granted literature
- US20060124694A1 Composite body and method for producing a mechanical joint Public/Granted day:2006-06-15
Information query
