Invention Grant
- Patent Title: Inspection method and inspection apparatus for inspecting electrical characteristics of inspection object
- Patent Title (中): 检查对象电气特性检查方法和检查装置
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Application No.: US12007403Application Date: 2008-01-10
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Publication No.: US07688088B2Publication Date: 2010-03-30
- Inventor: Shigekazu Komatsu , Tadatomo Suga , Toshihiro Itoh , Kenichi Kataoka
- Applicant: Shigekazu Komatsu , Tadatomo Suga , Toshihiro Itoh , Kenichi Kataoka
- Applicant Address: JP Tokyo JP Tokyo JP Chiba
- Assignee: Tokyo Electron Limited,Tadatomo Suga,Toshihiro Itoh
- Current Assignee: Tokyo Electron Limited,Tadatomo Suga,Toshihiro Itoh
- Current Assignee Address: JP Tokyo JP Tokyo JP Chiba
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner, LLP
- Priority: JP2003-164349 20030609
- Main IPC: G01R31/02
- IPC: G01R31/02 ; G01R31/26
Abstract:
At least one pair of electrode formed on a mounting surface of a stage is in contact with a conductive layer formed on a first surface of an inspection object, and an electrical path is formed between the both by using a fritting phenomenon.
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