Invention Grant
- Patent Title: Sharing conversion board for testing chips
- Patent Title (中): 分享转换板进行芯片测试
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Application No.: US12153728Application Date: 2008-05-23
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Publication No.: US07688093B2Publication Date: 2010-03-30
- Inventor: Hsuan-Chung Ko , Chen-Yang Hsieh
- Applicant: Hsuan-Chung Ko , Chen-Yang Hsieh
- Applicant Address: TW Hsinchu
- Assignee: King Yuan Electronics Co., Ltd.
- Current Assignee: King Yuan Electronics Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Bacon & Thomas, PLLC
- Priority: TW96148018A 20071214
- Main IPC: G01R31/02
- IPC: G01R31/02

Abstract:
The invention relates to a device interface board for testing chips, which is cooperatively installed with one of a plurality of probe cards. Each of the plurality of probe cards is provided with a specified wiring area and a first public signal area, the specified wiring area being electrically connected with the first public signal area. The first public signal area of each of the plurality of probe cards is located in a same particular area, and the specified wiring area of each of the plurality of probe cards is electrically connected with a testing jig and is different depending on a different testing jig. The device interface board comprises a chip test area and a second public signal area, in which the chip test area is used to carry a chip under test and is electrically connected with the second public signal area, whereby, through electrical connection between the device interface board and the first public signal area of each of the plurality of probe cards, test signals are transferred between the testing jig and the chip under test, and testing of chips under test having the same model are accomplished between different testing jigs.
Public/Granted literature
- US20090153162A1 Sharing conversion board for testing chips Public/Granted day:2009-06-18
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