Invention Grant
- Patent Title: Electrical connecting apparatus
- Patent Title (中): 电气连接装置
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Application No.: US11606547Application Date: 2006-11-29
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Publication No.: US07688094B2Publication Date: 2010-03-30
- Inventor: Eichi Osato
- Applicant: Eichi Osato
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Nihon Micronics
- Current Assignee: Kabushiki Kaisha Nihon Micronics
- Current Assignee Address: JP Tokyo
- Agency: Black, Lowe & Graham
- Priority: WOPCT/JP2004/010247 20040712
- Main IPC: G01R31/02
- IPC: G01R31/02

Abstract:
In an electrical connecting apparatus, a first guide is arranged in a plate-shaped lower base in which the contactors are arranged. The first guide has a first space for guiding a device under test so that its electrodes will contact the tips of contactors and for positioning the device under test against the contactors. The device under test is guided to the first space by second guides and is received and thrust by the tips of the contactors. By doing so, displacement of the device under test caused by displacement of the upper base or the second guides is prevented.
Public/Granted literature
- US20070069763A1 Electrical connecting apparatus Public/Granted day:2007-03-29
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