Invention Grant
- Patent Title: Wafer probe
- Patent Title (中): 晶圆探针
-
Application No.: US11796237Application Date: 2007-04-26
-
Publication No.: US07688097B2Publication Date: 2010-03-30
- Inventor: Leonard Hayden , John Martin , Mike Andrews
- Applicant: Leonard Hayden , John Martin , Mike Andrews
- Applicant Address: US OR Beaverton
- Assignee: Cascade Microtech, Inc.
- Current Assignee: Cascade Microtech, Inc.
- Current Assignee Address: US OR Beaverton
- Agency: Chernoff, Vilhauer, McClung & Stenzel
- Main IPC: G01R1/073
- IPC: G01R1/073 ; H01L21/00

Abstract:
The present invention relates to a probe tip assembly for testing of integrated circuits or other microelectronic devices. The probe tip assembly may include a plurality of independently flexible contact fingers extending from a support, each contact finger spaced apart from the other contact fingers, and each contact finger terminating in free space at an end distal from the support. A probe may be constructed by attaching the free ends of the contact fingers to electrical contacts on a circuit board and then removing the support from the contact fingers.
Public/Granted literature
- US20070200580A1 Wafer probe Public/Granted day:2007-08-30
Information query