Invention Grant
- Patent Title: SAW duplexer having a bridging inductor in a multilayer package
- Patent Title (中): SAW双工器在多层封装中具有桥接电感器
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Application No.: US11942562Application Date: 2007-11-19
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Publication No.: US07688159B2Publication Date: 2010-03-30
- Inventor: Masashi Omura , Norio Taniguchi
- Applicant: Masashi Omura , Norio Taniguchi
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2005-180717 20050621
- Main IPC: H03H9/72
- IPC: H03H9/72 ; H01F27/28 ; H01F5/04

Abstract:
A SAW duplexer includes a first SAW filter having a passband with a relatively low frequency, and a second SAW filter having a passband with a relatively high frequency. The first and second SAW filters each have a ladder-shaped circuit configuration. A bridging inductor is connected in parallel to at least one serial arm resonator in the second SAW filter. The bridging inductor includes a coiled portion provided on a multilayer package substrate. The coiled portion is defined by connecting first to third wires provided on first to third layers by via-hole conductors. First, third, and fifth via-hole conductors that define a coil return wire portion are disposed inside the coiled portion.
Public/Granted literature
- US20080061906A1 SAW DUPLEXER Public/Granted day:2008-03-13
Information query
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