Invention Grant
- Patent Title: Modular high-density computer system
- Patent Title (中): 模块化高密度计算机系统
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Application No.: US11880342Application Date: 2007-07-19
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Publication No.: US07688578B2Publication Date: 2010-03-30
- Inventor: Ronald M. Mann , Gary S. Landrum , Robert M. Hintz
- Applicant: Ronald M. Mann , Gary S. Landrum , Robert M. Hintz
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Main IPC: H05K7/20
- IPC: H05K7/20

Abstract:
A modular high-density computer system has an infrastructure that includes a framework component forming a plurality of bays and has one or more cooling components. The computer system also has one or more computational components that include a rack assembly and a plurality of servers installed in the rack assembly. Each of the one or more computational components is assembled and shipped to an installation site separately from the infrastructure and then installed within one of the plurality of bays after the infrastructure is installed at the site.
Public/Granted literature
- US20090021907A1 Modular high-density computer system Public/Granted day:2009-01-22
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