Invention Grant
- Patent Title: Flexible printed circuit board
- Patent Title (中): 柔性印刷电路板
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Application No.: US11586209Application Date: 2006-10-24
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Publication No.: US07688594B2Publication Date: 2010-03-30
- Inventor: Akira Muto , Tomokazu Tanaka
- Applicant: Akira Muto , Tomokazu Tanaka
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Rockey, Depke & Lyons, LLC
- Agent Robert J. Depke
- Priority: JP2005-317101 20051031
- Main IPC: H05K1/00
- IPC: H05K1/00

Abstract:
A flexible printed circuit board has an insulation layer, a first signal wiring layer including a microstrip line, a second signal wiring layer including a signal connection terminal for allowing the microstrip line to connect the exterior connector electrically, and a ground conductive section having a ground connection terminal for connecting the exterior connector. The microstrip line and the signal connection terminal are connected to each other by a wiring via hole. The wiring via hole passes through the insulation layer, the first signal wiring layer, and the second signal wiring layer. The microstrip line has a taper section which gradually enlarges a width of the microstrip line toward the wiring via hole in the vicinity of the wiring via hole. The ground conductive section that corresponds to the microstrip line has a taper section with a shape matching the taper section of the microstrip line.
Public/Granted literature
- US20070102830A1 Flexible printed circuit board Public/Granted day:2007-05-10
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