Invention Grant
- Patent Title: Method of manufacturing a face with different thickness distribution
- Patent Title (中): 制造不同厚度分布面的方法
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Application No.: US11723089Application Date: 2007-03-16
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Publication No.: US07690098B2Publication Date: 2010-04-06
- Inventor: Archer C. C. Chen
- Applicant: Archer C. C. Chen
- Applicant Address: TW Taichung
- Assignee: Cindy Rhodes
- Current Assignee: Cindy Rhodes
- Current Assignee Address: TW Taichung
- Agency: Browdy and Neimark, PLLC
- Main IPC: B23P13/04
- IPC: B23P13/04
Abstract:
A method of manufacturing a face with different thickness distribution is cutting a slice metal board with predestination shape from a metal board and stamping the slice metal board into an uneven metal board with predestination shape of rough and uneven on it then, milling one side of the uneven metal board to produce a board with different thickness. The final step is pressing the metal board with different thickness to form a face with different thickness distribution.
Public/Granted literature
- US20080040910A1 Method of manufacturing a face with different thickness distribution Public/Granted day:2008-02-21
Information query
